Invention Grant
- Patent Title: Process to form a tile using low temperature heat lamination
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Application No.: US16639465Application Date: 2018-08-16
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Publication No.: US11376833B2Publication Date: 2022-07-05
- Inventor: Yushan Hu , Ronald J. Weeks , Mark T. Jablonka , Lizhi Liu
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2018/000175 WO 20180816
- International Announcement: WO2019/035907 WO 20190221
- Main IPC: B32B37/06
- IPC: B32B37/06 ; B32B5/02 ; B32B7/12 ; B32B27/08 ; B32B27/12 ; B32B27/18 ; B32B27/32 ; C08L23/08

Abstract:
A method to produce a tile comprising at least the following layered sections: a wear layered section, a decor layered section and a base layered section; and wherein the wear layered section comprises the following: A) a compositional layer A formed from a composition A comprising at least one olefin-based polymer; wherein the decor layered section comprises the following: B1) a compositional layer B1 formed from a composition B1 comprising a propylene-based polymer; B2) a compositional layer B2 formed from a composition B2 comprising an olefin-based polymer; wherein the base layered section comprises the following: C) a compositional layer C formed from a composition C comprising an olefin-based polymer; wherein the method comprises the following step(s): i) heat laminating compositional layer A to compositional layer B1, at a temperature T1≤140° C.; and wherein, for a continuous production of the tile, T1 is the temperature at the surface of the compositional layer with the highest, or equivalent, surface temperature; and for a batch production of the tile, T1 is the interfacial temperature between the two compositional layers; ii) heat laminating compositional layer B2 to compositional layer C, at a interfacial temperature T2≤140° C.; and wherein, for a continuous production of the tile, T2 is the temperature at the surface of the compositional layer with the highest, or equivalent, surface temperature; and for a batch production of the tile, T2 is the interfacial temperature between the two compositional layers.
Public/Granted literature
- US20210129513A1 PROCESS TO FORM A TILE USING LOW TEMPERATURE HEAT LAMINATION Public/Granted day:2021-05-06
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