Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US17005578Application Date: 2020-08-28
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Publication No.: US11376850B2Publication Date: 2022-07-05
- Inventor: Harunobu Koike , Shunsuke Yoshida
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2019-157935 20190830
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/045

Abstract:
A liquid ejecting head including a flow path forming substrate in which a pressure chamber in communication with a nozzle is formed, a diaphragm formed on the flow path forming substrate, and a piezoelectric actuator including a first electrode, a piezoelectric layer, and a second electrode that are formed on the diaphragm. In the liquid ejecting head, a center portion of the diaphragm is not provided with an active portion, which is a portion where the piezoelectric layer is interposed between the first electrode and the second electrode, a protective film that covers the diaphragm is formed in the center portion, and compressive stress of the protective film is larger than that of the diaphragm.
Public/Granted literature
- US20210060949A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2021-03-04
Information query
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