Invention Grant
- Patent Title: Half cutter, method of manufacturing half cutter, and tape printing device
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Application No.: US16625156Application Date: 2018-06-11
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Publication No.: US11376874B2Publication Date: 2022-07-05
- Inventor: Kenji Motai , Tadashi Inaba
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-121944 20170622
- International Application: PCT/JP2018/022185 WO 20180611
- International Announcement: WO2018/235646 WO 20181227
- Main IPC: B41J11/66
- IPC: B41J11/66 ; B26D1/06 ; B26D1/30 ; B41J11/00 ; B41J11/70

Abstract:
A half cutter includes a cutting blade having a blade and a holder to which the blade is fixed, a blade receiving member having a blade receiving surface from and with which the blade is separated and comes into contact, and a spacer having at least one of a holder spacer arranged at the holder which is made of a material that is different from a material of the holder, is provided in the holder to protrude toward the blade receiving surface further than the blade, and generates a gap between the blade and the blade receiving surface and a blade receiving spacer arranged at the blade receiving surface which is made of a material different from a material of the blade receiving member, is provided to protrude from the blade receiving surface, and generates a gap between the blade and the blade receiving surface.
Public/Granted literature
- US20210331342A1 HALF CUTTER, METHOD OF MANUFACTURING HALF CUTTER, AND TAPE PRINTING DEVICE Public/Granted day:2021-10-28
Information query
IPC分类: