Invention Grant
- Patent Title: Low emission polyoxymethylene composition
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Application No.: US16869304Application Date: 2020-05-07
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Publication No.: US11377516B2Publication Date: 2022-07-05
- Inventor: Sung Hye Kim , Rong Luo , Jared T. Kindt
- Applicant: Ticona LLC
- Applicant Address: US KY Florence
- Assignee: Ticona LLC
- Current Assignee: Ticona LLC
- Current Assignee Address: US KY Florence
- Agency: Dority & Manning, P.A.
- Main IPC: C08K5/3445
- IPC: C08K5/3445 ; C08K5/3492 ; C08L59/04 ; C08G2/08 ; C08K5/17 ; C08L61/02 ; C08K5/00 ; C08L59/02 ; C08K5/16 ; C08K5/31 ; A61M15/00 ; A61M5/31 ; A61M5/178

Abstract:
A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.
Public/Granted literature
- US20200262962A1 Low Emission Polyoxymethylene Composition Public/Granted day:2020-08-20
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