Invention Grant
- Patent Title: Approach to heat expandable materials
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Application No.: US16316017Application Date: 2017-07-19
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Publication No.: US11377532B2Publication Date: 2022-07-05
- Inventor: Geng Lin , Leslie Wolschleger , Nicolae Bordeanu
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP16180389 20160720
- International Application: PCT/EP2017/068282 WO 20170719
- International Announcement: WO2018/015461 WO 20180125
- Main IPC: C08J9/10
- IPC: C08J9/10 ; C08J9/08 ; C08L63/00 ; C08J9/00 ; B29C44/02 ; C08G59/24 ; C08L23/08 ; B29K63/00 ; C08G101/00

Abstract:
A thermally expandable composition, including at least one epoxy-functional polymer, at least one thermoplastic polymer, at least one chemical blowing agent, and at least one activator, wherein the epoxy-functional polymer is present in the composition before expansion with an amount of between 30 and 75 wt.-%, based on the total composition, and the epoxy-functional polymer includes at least 300 mmol epoxy groups per kg polymer, and wherein the chemical blowing agent is able to form at least one reaction product with at least two amino groups upon thermal decomposition, and the chemical blowing agent is in the composition before expansion with an amount of between 5 and 30 wt.-%, based on the total composition.
Public/Granted literature
- US20190276624A1 NEW APPROACH TO HEAT EXPANDABLE MATERIALS Public/Granted day:2019-09-12
Information query