Invention Grant
- Patent Title: Resin composition, laminate sheet, and multilayer printed wiring board
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Application No.: US16318726Application Date: 2017-07-18
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Publication No.: US11377546B2Publication Date: 2022-07-05
- Inventor: Takao Tanigawa , Tetsuroh Irino , Minoru Kakitani , Kouji Morita
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPJP2016-141387 20160719
- International Application: PCT/JP2017/025977 WO 20170718
- International Announcement: WO2018/016489 WO 20180125
- Main IPC: C08L39/04
- IPC: C08L39/04 ; B32B15/08 ; C08J5/18 ; H05K1/03 ; C08K5/3415 ; C08L35/00 ; B32B27/34 ; C08L101/00
Abstract:
The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.
Public/Granted literature
- US20190241729A1 RESIN COMPOSITION, LAMINATE SHEET, AND MULTILAYER PRINTED WIRING BOARD Public/Granted day:2019-08-08
Information query
