• Patent Title: Photosensitive epoxy resin composition for formation of optical waveguide, photosensitive film for formation of optical waveguide, optical waveguide produced by using the epoxy resin composition or the photosensitive film, and hybrid flexible printed wiring board for optical/electrical transmission
  • Application No.: US16071172
    Application Date: 2017-01-20
  • Publication No.: US11377550B2
    Publication Date: 2022-07-05
  • Inventor: Tomoyuki HirayamaNaoyuki Tanaka
  • Applicant: NITTO DENKO CORPORATION
  • Applicant Address: JP Ibaraki
  • Assignee: NITTO DENKO CORPORATION
  • Current Assignee: NITTO DENKO CORPORATION
  • Current Assignee Address: JP Ibaraki
  • Agency: WHDA, LLP
  • Priority: JPJP2016-015458 20160129
  • International Application: PCT/JP2017/001842 WO 20170120
  • International Announcement: WO2017/130849 WO 20170803
  • Main IPC: C08L63/00
  • IPC: C08L63/00 G02B6/122 G03F7/00 G03F7/028 H05K1/02 G02B6/12
Photosensitive epoxy resin composition for formation of optical waveguide, photosensitive film for formation of optical waveguide, optical waveguide produced by using the epoxy resin composition or the photosensitive film, and hybrid flexible printed wiring board for optical/electrical transmission
Abstract:
A photosensitive epoxy resin composition for formation of an optical waveguide is provided, which contains an epoxy resin component and a photo-cationic polymerization initiator, wherein the epoxy resin component includes: (a) a solid bisphenol-A epoxy resin having a softening point of not higher than 105° C.; (b) a solid polyfunctional aliphatic epoxy resin having a softening point of not higher than 105° C.; and (c) a liquid long-chain bifunctional semi-aliphatic epoxy resin, wherein the epoxy resin (a) is present in a proportion of 60 to 70 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (b) is present in a proportion of 20 to 35 wt. % based on the weight of the epoxy resin component, wherein the epoxy resin (c) is present in a proportion of 5 to 10 wt. % based on the weight of the epoxy resin component.
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