Invention Grant
- Patent Title: Heat transfer device and heat transfer method using same
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Application No.: US16468040Application Date: 2017-12-08
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Publication No.: US11377578B2Publication Date: 2022-07-05
- Inventor: Tatsumi Tsuchiya , Kouhei Koba , Masaru Tanaka
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2016-241257 20161213
- International Application: PCT/JP2017/044207 WO 20171208
- International Announcement: WO2018/110454 WO 20180621
- Main IPC: C09K5/04
- IPC: C09K5/04 ; F25B13/00

Abstract:
A heat transfer device that contains a circulation route enclosing a refrigerant containing a hydrohaloolefin, the heat transfer device being capable of reducing the influence of oxygen entrapped in the circulation route; and a heat transfer method using the heat transfer device. Also, a heat transfer device that contains a circulation route enclosing a refrigerant containing at least one member selected from the group consisting of hydrofluoroolefins (HFOs), hydrochlorofluoroolefins (HCFOs), and hydrochloroolefins (HCOs); and the device containing an oxygen adsorption device between an evaporator and a compressor present in the circulation route; and a heat transfer method using the same.
Public/Granted literature
- US20200017742A1 HEAT TRANSFER DEVICE AND HEAT TRANSFER METHOD USING SAME Public/Granted day:2020-01-16
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