Invention Grant
- Patent Title: Method for producing piping and method for forming oxide film on inner surface of copper pipe
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Application No.: US16332958Application Date: 2017-09-26
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Publication No.: US11377742B2Publication Date: 2022-07-05
- Inventor: Yutaka Shibata
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-192885 20160930
- International Application: PCT/JP2017/034682 WO 20170926
- International Announcement: WO2018/062146 WO 20180405
- Main IPC: C23C22/52
- IPC: C23C22/52 ; C23C8/10 ; C23C22/68 ; C23F11/18 ; C23C22/78 ; F28F21/08 ; F28F19/00 ; C23F11/00 ; C23C8/40 ; F28F19/06
Abstract:
A pipe is manufactured through injecting a chloride ion-containing aqueous solution into a copper pipe to fill the copper pipe, thereby forming a copper oxide film on an inner surface of the copper pipe.
Public/Granted literature
- US20190249309A1 METHOD FOR PRODUCING PIPING AND METHOD FOR FORMING OXIDE FILM ON INNER SURFACE OF COPPER PIPE Public/Granted day:2019-08-15
Information query
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