Invention Grant
- Patent Title: Polycrystalline diamond compact
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Application No.: US16543607Application Date: 2019-08-18
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Publication No.: US11377910B2Publication Date: 2022-07-05
- Inventor: Dongpeng Zhao , Weifeng Du , Shanshan Ma , Tongjian Niu , Haijiang Fang
- Applicant: SF Diamond Co., Ltd.
- Applicant Address: CN Zhengzhou
- Assignee: SF Diamond Co., Ltd.
- Current Assignee: SF Diamond Co., Ltd.
- Current Assignee Address: CN Zhengzhou
- Agency: Matthias Scholl P.C.
- Agent Matthias Scholl
- Priority: CN201721524171 20171115
- Main IPC: B24D3/02
- IPC: B24D3/02 ; E21B10/567 ; C04B37/02 ; B24D3/00 ; B24D11/00 ; B24D18/00 ; C09K3/14

Abstract:
A polycrystalline diamond compact including a cemented carbide substrate and a polycrystalline diamond layer bonded to the cemented carbide substrate. The polycrystalline diamond layer is nonplanar and includes a central part and a peripheral part surrounding the central part. The central part includes a protruding surface relative to the peripheral part. The protruding surface is spherical or planar. The peripheral part includes a plurality of radially-disposed ridges.
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