Invention Grant
- Patent Title: High-temperature and/or high pressure gas enclosure
-
Application No.: US16925839Application Date: 2020-07-10
-
Publication No.: US11378230B2Publication Date: 2022-07-05
- Inventor: Yinbin Miao , Nicolas E. Stauff , Sumit Bhattacharya , Abdellatif M. Yacout , Taek K. Kim
- Applicant: UCHICAGO ARGONNE, LLC
- Applicant Address: US IL Chicago
- Assignee: UCHICAGO ARGONNE, LLC
- Current Assignee: UCHICAGO ARGONNE, LLC
- Current Assignee Address: US IL Chicago
- Agency: Marshall, Gerstein & Borun LLP
- Main IPC: F17C1/10
- IPC: F17C1/10 ; F17C1/14

Abstract:
A gas enclosure can include a refractory metal liner; a ceramic matrix composite cladding; and a diffusion barrier layer. The refractory metal liner is adapted to surround and enclose a gas to be contained within the gas enclosure. The diffusion barrier layer is disposed between the refractory metal liner and the ceramic matrix composite cladding.
Public/Granted literature
- US20220010929A1 HIGH-TEMPERATURE AND/OR HIGH PRESSURE GAS ENCLOSURE Public/Granted day:2022-01-13
Information query
IPC分类: