An apparatus for performing a contact mechanics test in a substrate includes a stylus having at least two contact elements. Each contact element has a contact profile, and the contact elements are disposed in the stylus to define a stretch passage therebetween. The stylus is configured to deform the substrate so as to cause the substrate to flow between the contact elements and induce tension in the substrate in order to generate and preserve micromodifications in the substrate. Methods of performing a contact mechanics test using the apparatus are also provided.