A method for detecting an abnormal die includes providing a wafer, determining the surrounding dies in accordance with a position of a target die on the wafer, calculating a difference between a value of an electrical characteristic of each of the surrounding dies and a value of an electrical characteristic of the target die to obtain the electrical characteristic deviations, ranking the absolute values of the electrical characteristic deviations to generate a ranking result, and determining the characteristic-related dies from the surrounding dies in accordance with the ranking result, determining a target-related area in accordance with the position of the target die, determining the target-related die from the characteristic-related dies in accordance with the target-related area and determining whether the target die is qualified in accordance with the target-related die.