Invention Grant
- Patent Title: Techniques for compact optical sensing module with hybrid multi-chip integration
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Application No.: US17494679Application Date: 2021-10-05
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Publication No.: US11378664B1Publication Date: 2022-07-05
- Inventor: Zhizhong Tang , Pradeep Srinivasan , Bing Shen
- Applicant: AEVA, INC.
- Applicant Address: US CA Mountain View
- Assignee: AEVA, INC.
- Current Assignee: AEVA, INC.
- Current Assignee Address: US CA Mountain View
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: G01S7/481
- IPC: G01S7/481 ; G01S7/486 ; H01L21/60 ; H01L25/16 ; G01S7/4863 ; G01S17/32 ; G01S17/89

Abstract:
A light detection and ranging (LIDAR) system and apparatus including a photonics chip coupled to a substrate, the photonics chip including an optical source to generate an optical beam, a waveguide to direct the optical beam through the photonics chip, a photodetector to generate an electrical signal in response to detecting a return signal, and an optical coupler to transmit the optical beam from the waveguide to a target in the field of view of the LIDAR apparatus. The system and apparatus may further include an integrated circuit (IC) chip coupled to the photonics chip, the IC chip to process the electrical signal generated by the photodetector.
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