Invention Grant
- Patent Title: Ultrasonic device and ultrasonic apparatus
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Application No.: US16690527Application Date: 2019-11-21
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Publication No.: US11378670B2Publication Date: 2022-07-05
- Inventor: Chikara Kojima , Koji Ohashi , Hironori Suzuki , Tomohide Onogi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-218978 20181122
- Main IPC: G01S7/521
- IPC: G01S7/521

Abstract:
An ultrasonic device includes nine ultrasonic array units arranged in a grid pattern of three rows and three columns, nine drive bypass wires that input and output drive signals to and from the respective ultrasonic array units, a first common bypass wire to which a common potential is applied, coupled to the eight ultrasonic array units, a second common bypass wire coupled to the ultrasonic array unit to which the first common bypass wire is not coupled, and a third common bypass wire coupling the first and the second common bypass wires. One of the drive bypass wires, the first common bypass wire, and the second common bypass wire is placed between the ultrasonic array units placed adjacent to each other. The third common bypass wire is placed inside of the ultrasonic array unit placed adjacent to the ultrasonic array unit coupled to the second common bypass wire.
Public/Granted literature
- US20200166618A1 ULTRASONIC DEVICE AND ULTRASONIC APPARATUS Public/Granted day:2020-05-28
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