Invention Grant
- Patent Title: Method for III-V/silicon hybrid integration
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Application No.: US17167065Application Date: 2021-02-03
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Publication No.: US11378762B2Publication Date: 2022-07-05
- Inventor: Guomin Yu , Mohamad Dernaika , Ludovic Caro , Hua Yang , Aaron John Zilkie
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB Altrincham
- Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee Address: GB Altrincham
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/136 ; H01S5/02326

Abstract:
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
Public/Granted literature
- US20210181437A1 METHOD FOR III-V/SILICON HYBRID INTEGRATION Public/Granted day:2021-06-17
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