A memory device can comprise an arrays of memory cells comprising a plurality of vertically stacked tiers of memory cells, a respective plurality of horizontal access lines coupled to each of the plurality of tiers of memory cells, and a plurality of vertical sense lines coupled to each of the plurality of tiers of memory cells. The array of memory cells can further comprise a plurality of multiplexors each coupled to a respective vertical sense line, wherein each of the plurality of multiplexors includes a first portion and a second portion, the first portion is coupled to the array of memory cells and the second portion is formed on a substrate material. The array of memory cells can further comprise a semiconductor under the array (SuA) circuitry comprising a plurality of sense amplifiers, each sense amplifier coupled to a respective subset of the plurality of multiplexors.