Invention Grant
- Patent Title: Coil component
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Application No.: US16293202Application Date: 2019-03-05
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Publication No.: US11380475B2Publication Date: 2022-07-05
- Inventor: Mi Geum Kim , Byeong Cheol Moon , Joung Gul Ryu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0106426 20180906
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/30 ; H01F27/32

Abstract:
A coil component includes a body including a magnetic metal powder; an internal insulating layer buried in the body; an internal coil portion disposed on the internal insulating layer, and having turns of which cross-sectional areas increase towards the internal insulating layer from externally of the internal insulating layer; an external insulating layer covering the internal coil portion; an external coil portion disposed on the external insulating layer, and having a greater number of turns than a number of turns of the internal coil portion; a connection via penetrating through the external insulating layer and connecting the internal coil portion and the external coil portion; and an insulating film surrounding the internal insulating layer, the internal coil portion, the external insulating layer, and the external coil portion.
Public/Granted literature
- US20200082974A1 COIL COMPONENT Public/Granted day:2020-03-12
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