Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US16869893Application Date: 2020-05-08
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Publication No.: US11380484B2Publication Date: 2022-07-05
- Inventor: Jong Duck Kim , Jae Sun Won , Jae Joon Yu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0009507 20200123
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/248 ; H01G4/012

Abstract:
A multilayer electronic component includes a body including a first internal electrode and a second internal electrode alternately disposed in a first direction with a dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction. A first external electrode is disposed on the third, fourth, fifth, and sixth surfaces. A second external electrode is disposed on one or more of the first and second surfaces, and a via electrode is exposed through a surface on which the second external electrode is disposed. A ratio W/L is 0.95 or more and 1.05 or less, where L is a length of the body and W is a width of the body.
Public/Granted literature
- US20210233710A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2021-07-29
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