Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16815116Application Date: 2020-03-11
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Publication No.: US11380540B2Publication Date: 2022-07-05
- Inventor: Takashi Nakagawa , Yoshiro Hirose , Naofumi Ohashi , Tadashi Takasaki
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JPJP2019-175993 20190926
- Main IPC: C23C16/40
- IPC: C23C16/40 ; H01L21/02 ; H01L21/687 ; H01L21/67 ; H01L21/205 ; C23C16/34 ; C23C16/44 ; H01L21/677 ; C23C16/458

Abstract:
There is provided a technique that includes: substrate mounting plate where substrates are arranged circumferentially; rotator rotating the substrate mounting plate; gas supply structure disposed above the substrate mounting plate from center to outer periphery thereof; gas supplier including the gas supply structure and controlling supply amount of gas supplied from the gas supply structure; gas exhaust structure installed above the substrate mounting plate at downstream side of the gas supply structure in rotation direction; gas exhauster including the gas exhaust structure and controlling exhaust amount of gas exhausted from the gas exhaust structure; and gas main component amount controller including the gas supplier and the gas exhauster and controlling gas main component amount in the gas supplied from the gas supply structure to the substrates and the gas main component amount in the gas supplied to the substrates from the center to the outer periphery of the mounting plate.
Public/Granted literature
- US20210098250A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-04-01
Information query
IPC分类: