Invention Grant
- Patent Title: Cutting method
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Application No.: US16632291Application Date: 2018-07-18
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Publication No.: US11380586B2Publication Date: 2022-07-05
- Inventor: Toshiki Manabe , Takehiko Senoo , Koichi Izumi , Tadashi Shojo , Takafumi Ogiwara , Takeshi Sakamoto
- Applicant: IWATANI CORPORATION , HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Osaka; JP Shizuoka
- Assignee: IWATANI CORPORATION,HAMAMATSU PHOTONICS K.K.
- Current Assignee: IWATANI CORPORATION,HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Osaka; JP Shizuoka
- Agency: Studebaker & Brackett PC
- Priority: JPJP2017-140871 20170720
- International Application: PCT/JP2018/026851 WO 20180718
- International Announcement: WO2019/017367 WO 20190124
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/268 ; H01L21/3065

Abstract:
A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.
Information query
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