Invention Grant
- Patent Title: Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer
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Application No.: US16895186Application Date: 2020-06-08
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Publication No.: US11380587B2Publication Date: 2022-07-05
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2019-107315 20190607
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/02 ; H01L21/304 ; H01L21/447 ; H01L21/768 ; B23K26/364 ; B23K26/40 ; C09J7/25 ; H01L21/683
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.
Information query
IPC分类:
