Invention Grant
- Patent Title: Semiconductor module, vehicle, and method of manufacturing semiconductor module
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Application No.: US16799679Application Date: 2020-02-24
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Publication No.: US11380599B2Publication Date: 2022-07-05
- Inventor: Kohei Yamauchi , Tatsuhiko Asai
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JPJP2019-116218 20190624
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/28 ; H01L23/31 ; H05K1/11 ; H01L23/538 ; H01L21/56
Abstract:
There is provided a semiconductor module including: a base for semiconductor cooling; a stacked substrate provided above the base; a semiconductor chip provided above the stacked substrate; a coating layer provided on an upper surface of the semiconductor chip; and a sealing resin for sealing the semiconductor chip, in which the base is in contact with the sealing resin.
Information query
IPC分类:
