Invention Grant
- Patent Title: Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die
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Application No.: US16934338Application Date: 2020-07-21
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Publication No.: US11380640B2Publication Date: 2022-07-05
- Inventor: Jin Won Jeong , Jae Sik Choi , Byeung Soo Song
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR10-2020-0033842 20200319
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L51/56 ; H01L23/00 ; H01L21/3065 ; H01L21/268 ; H01L21/304 ; H01L51/00 ; H01L25/16 ; H01L21/78
Abstract:
A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.
Public/Granted literature
- US20210296271A1 FABRICATION METHOD OF SEMICONDUCTOR DIE AND CHIP-ON-PLASTIC PACKAGING OF SEMICONDUCTOR DIE Public/Granted day:2021-09-23
Information query
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