A semiconductor package includes a base substrate; a printed circuit board disposed on the base substrate; a first chip stack disposed on the base substrate on one side of the printed circuit board, and including first semiconductor chips offset-stacked in a first offset direction facing the printed circuit board; a second chip stack disposed on the first chip stack, and including second semiconductor chips offset-stacked in a second offset direction facing away from the printed circuit board; a third chip stack disposed on the base substrate on the other side of the printed circuit board, and including third semiconductor chips offset-stacked in the second offset direction; and a fourth chip stack disposed on the third chip stack, and including fourth semiconductor chips offset-stacked in the first offset direction, wherein the second and fourth chip stacks are electrically connected with the base substrate through the printed circuit board.