Invention Grant
- Patent Title: Radio-frequency module and communication apparatus
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Application No.: US17023410Application Date: 2020-09-17
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Publication No.: US11380654B2Publication Date: 2022-07-05
- Inventor: Sho Matsumoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2018-057103 20180323
- Main IPC: H03F3/195
- IPC: H03F3/195 ; H05K1/02 ; H01L23/48 ; H01L23/488 ; H01L25/065 ; H03F1/56 ; H03F3/24 ; H04B1/40
Abstract:
A radio-frequency module including a mounting substrate that has mounting faces opposed to each other; a PA that is mounted on the mounting face, that is a radio-frequency component, and that has an emitter terminal; a through electrode that is connected to the emitter terminal of the PA and that passes through the mounting faces of the mounting substrate; and a ground terminal connected to the through electrode.
Public/Granted literature
- US20210005579A1 RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2021-01-07
Information query
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