Invention Grant
- Patent Title: Transistor devices and methods of forming a transistor device
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Application No.: US16860087Application Date: 2020-04-28
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Publication No.: US11380677B2Publication Date: 2022-07-05
- Inventor: Jiacheng Lei , Lawrence Selvaraj Susai
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Viering Jentschura & Partner MBB
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L27/06 ; H01L29/20 ; H01L29/205 ; H01L29/423 ; H01L21/8252 ; H01L29/66 ; H01L21/28 ; H01L21/306 ; H01L21/3213 ; H01L29/872

Abstract:
According to various embodiments, a transistor device may include a semiconductor structure having a trench formed therein. The semiconductor structure may include a buffer layer and a barrier layer arranged over the buffer layer. The trench may extend at least to the buffer layer. The transistor device may include a source terminal, a drain terminal, and a gate terminal arranged between the source terminal and the drain terminal. The gate terminal may extend into the trench. The transistor device may include an electrode component. The electrode component may include an electrode. The electrode component may extend into the trench where the electrode component is separated from the gate terminal. The electrode component may contact a side wall of the trench.
Public/Granted literature
- US20210335778A1 TRANSISTOR DEVICES AND METHODS OF FORMING A TRANSISTOR DEVICE Public/Granted day:2021-10-28
Information query
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