Invention Grant
- Patent Title: Semiconductor device with superlattice fin
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Application No.: US17061941Application Date: 2020-10-02
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Publication No.: US11380685B2Publication Date: 2022-07-05
- Inventor: Junjing Bao , Ye Lu , Chenjie Tang , Peijie Feng
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson+ Sheridan, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L29/423 ; H01L27/092

Abstract:
Certain aspects of the present disclosure relate to a semiconductor device (e.g., a gate-all-around (GAA) semiconductor device) comprising at least one superlattice fin. One example superlattice fin includes a first plurality of nanosheets composed of a first semiconductor material and a second plurality of nanosheets composed of a second semiconductor material, the second semiconductor material being different from the first semiconductor material, wherein a width of a first nanosheet in the first plurality of nanosheets differs from a width of a second nanosheet in the second plurality of nanosheets, the second nanosheet being adjacent to the first nanosheet.
Public/Granted literature
- US20220108983A1 SEMICONDUCTOR DEVICE WITH SUPERLATTICE FIN Public/Granted day:2022-04-07
Information query
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