Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16886572Application Date: 2020-05-28
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Publication No.: US11380768B2Publication Date: 2022-07-05
- Inventor: Shih-Cheng Chen , Chun-Hsiung Lin , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/762 ; H01L21/764 ; H01L21/768 ; H01L29/40 ; H01L21/8238 ; H01L23/522

Abstract:
A device includes an active region, a gate structure, an epitaxial structure, an epitaxial layer, a metal alloy layer, a contact, and a contact etch stop layer. The gate structure is across the active region. The epitaxial structure is above the active region and adjacent the gate structure. The epitaxial layer is above the epitaxial structure. The metal alloy layer is above the epitaxial layer. The contact is above the metal alloy layer. The contact etch stop layer lines sidewalls of the epitaxial structure. The metal alloy layer is spaced apart from the contact etch stop layer.
Public/Granted literature
- US20210376095A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-12-02
Information query
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