Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16656210Application Date: 2019-10-17
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Publication No.: US11380785B2Publication Date: 2022-07-05
- Inventor: Sheng-Kai Su
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/66 ; H01L29/78 ; H01L29/24

Abstract:
A semiconductor device includes a substrate, a gate structure, semimetallic source/drain structures, and source/drain contacts. The gate structure is over the substrate. The semimetallic source/drain structures are respectively on opposite sides of the gate structure, in which a band structure of each of the semimetallic source/drain structures has a valence band and a conduction band at different symmetry k-points. The source/drain contacts land on top surfaces of the semimetallic source/drain structures, respectively.
Public/Granted literature
- US20210119027A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-04-22
Information query
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