Invention Grant
- Patent Title: Phase change memory using multiple stacks of PCM materials
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Application No.: US16789502Application Date: 2020-02-13
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Publication No.: US11380843B2Publication Date: 2022-07-05
- Inventor: Tian Shen , Heng Wu , Kevin W. Brew , Jingyun Zhang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Randall Bluestone
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A method is presented for improved linearity of a phase change memory (PCM) cell structure. The method includes forming a bottom electrode over a substrate, constructing a PCM stack including a plurality of PCM layers each having a different crystallization temperature over the bottom electrode, and forming a top electrode over the PCM stack. The crystallization temperature varies in an ascending order from the bottom electrode to the top electrode.
Public/Granted literature
- US20210257547A1 PHASE CHANGE MEMORY USING MULTIPLE STACKS OF PCM MATERIALS Public/Granted day:2021-08-19
Information query
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