Invention Grant
- Patent Title: Radio frequency circuit, multiplexer, radio frequency front end circuit and communication apparatus
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Application No.: US16855006Application Date: 2020-04-22
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Publication No.: US11381217B2Publication Date: 2022-07-05
- Inventor: Hirotsugu Mori , Hideki Tsukamoto , Taizo Hisano
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-205569 20171024
- Main IPC: H03H7/46
- IPC: H03H7/46 ; H03F3/19 ; H03H1/00 ; H03H7/01 ; H03H7/075 ; H03H9/70 ; H04J1/02

Abstract:
A radio frequency circuit includes a multilayer substrate, series arm circuits in a first path connecting the input/output terminals (T1 and T2) on the multilayer substrate, a parallel arm circuit in a second path connecting a node on the first path and a ground, a wiring A on the multilayer substrate connected to the input/output terminal (T1) as a part of the first path, a wiring B on the multilayer substrate connected to the input/output terminal (T2) as a part of the first path, and a wiring C on the multilayer substrate as a part of the second path. The parallel arm circuit includes an impedance variable circuit, the wiring A and the wiring B in a layer different from the multilayer substrate. When viewed in a plan view, the wiring C does not overlap with the wiring A and the wiring B.
Public/Granted literature
- US20200252042A1 RADIO FREQUENCY CIRCUIT, MULTIPLEXER, RADIO FREQUENCY FRONT END CIRCUIT AND COMMUNICATION APPARATUS Public/Granted day:2020-08-06
Information query
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