Invention Grant
- Patent Title: Dispersion compensation in mm-wave communication over plastic waveguide using OFDM
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Application No.: US16527109Application Date: 2019-07-31
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Publication No.: US11381441B2Publication Date: 2022-07-05
- Inventor: Sai-Wang Tam , Su Chenxin , Vijay Ahirwar , Rulin Huang , Alden C. Wong , Rui Cao , Sudhir Srinivasa , Alireza Razzaghi , Randy Tsang , Timothy J. Donovan
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H04L27/26
- IPC: H04L27/26 ; H04L25/03

Abstract:
A millimeter-wave communication system includes a transmitter and a receiver. The transmitter is configured to be connected to a waveguide that is transmissive at millimeter-wave frequencies, the waveguide having a propagation parameter that varies with frequency at the millimeter-wave frequencies. The transmitter is configured to generate a millimeter-wave signal comprising multiple sub-carriers that are modulated with data, wherein each sub-carrier is modulated with a respective portion of the data and is subjected to only a respective fraction of a variation in the propagation parameter, and to transmit the millimeter-wave signal into a first end of the waveguide. The receiver is configured to receive the millimeter-wave signal from a second end of the waveguide, and to extract the data from the multiple sub-carriers.
Public/Granted literature
- US20200169444A1 Dispersion compensation in MM-wave communication over plastic waveguide using OFDM Public/Granted day:2020-05-28
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