A camera module includes an imaging sensor, a light emitter, and a circuit board. The circuit board includes first and second rigid printed wiring boards, and a foldable flexible printed wiring board connecting the two. A surface of the first rigid printed wiring board on which the imaging sensor is mounted has a holder which is configured to hold the second rigid printed wiring board in a state in which a surface of the second rigid printed wiring board on which the light emitter is mounted and the surface on which the imaging sensor is mounted face the same direction. The holder is arranged at a position which is different from the imaging sensor, and holds the second rigid printed wiring board at a height higher than the surface of the first rigid printed wiring board.