Invention Grant
- Patent Title: Receiving apparatus, communication system, and receiving apparatus control method
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Application No.: US17250470Application Date: 2019-05-15
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Publication No.: US11381870B2Publication Date: 2022-07-05
- Inventor: Satoshi Okada , Yutaka Nakada , Ryosuke Suda
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2018-146028 20180802
- International Application: PCT/JP2019/019231 WO 20190515
- International Announcement: WO2020/026559 WO 20200206
- Main IPC: H04N21/438
- IPC: H04N21/438 ; H04B1/16 ; H04N21/4385

Abstract:
Channel bonding is realized in a receiving apparatus that receives terrestrial digital broadcasting compliant with an ATSC 3.0 Standard. A receiving section selects any one of a plurality of frequency channels as a bonding source channel and receives a frame from the bonding source channel. A control section performs processing for obtaining one frequency channel in which packets are to be bonded with the bonding source channel among the plurality of frequency channel as a bonding destination channel on the basis of the frame and processing for controlling the receiving section to newly receive a frame from the bonding destination channel. A decoding section decodes the frame and acquires the packets. A bonding section bonds together the packets corresponding to the bonding source channel and the packets corresponding to the bonding destination channel.
Public/Granted literature
- US20210289257A1 RECEIVING APPARATUS, COMMUNICATION SYSTEM, AND RECEIVING APPARATUS CONTROL METHOD Public/Granted day:2021-09-16
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