Invention Grant
- Patent Title: Power adapter enclosures
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Application No.: US17046118Application Date: 2018-07-31
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Publication No.: US11382225B2Publication Date: 2022-07-05
- Inventor: David Quijano , Adolfo Adolfo Gomez
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2018/044589 WO 20180731
- International Announcement: WO2020/027801 WO 20200206
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04 ; H05K5/02 ; G06F1/18 ; H05K5/00
Abstract:
A power adapter unit may include, in an example, a first piece comprising an enclosure to place a power adapter therein; a second piece to contain the power adapter within the power adapter unit; and a cable wrapping surface formed by the second piece being coupled to the first piece.
Public/Granted literature
- US20210144869A1 POWER ADAPTER ENCLOSURES Public/Granted day:2021-05-13
Information query
