Invention Grant
- Patent Title: Fan module
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Application No.: US17030344Application Date: 2020-09-23
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Publication No.: US11382239B2Publication Date: 2022-07-05
- Inventor: Hong-Si Wang
- Applicant: ACCTON TECHNOLOGY CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: ACCTON TECHNOLOGY CORPORATION
- Current Assignee: ACCTON TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., LLC
- Priority: TW108215612 20191125
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01R12/75 ; H01R13/66

Abstract:
A fan module configured to be detachably connected to an electronic device includes an electrical connector and a circuit board assembly. The electrical connector includes a plurality of pins configured to be electrically connected to the electronic device. The circuit board assembly is embedded inside the electrical connector and is electrically connected to one or more of the pins. The circuit board assembly includes a circuit board and an integrated circuit disposed on the circuit board.
Public/Granted literature
- US20210161031A1 FAN MODULE Public/Granted day:2021-05-27
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