Invention Grant
- Patent Title: Ultra-thin conductor based semi-transparent electromagnetic interference shielding
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Application No.: US17435540Application Date: 2020-02-28
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Publication No.: US11382245B2Publication Date: 2022-07-05
- Inventor: Lingjie Jay Guo , Heyan Wang
- Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Applicant Address: US MI Ann Arbor
- Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee Address: US MI Ann Arbor
- Agency: Harness, Dickey & Pierce, P.L.C.
- International Application: PCT/US2020/020462 WO 20200228
- International Announcement: WO2020/180715 WO 20200910
- Main IPC: F03G4/00
- IPC: F03G4/00 ; F16L21/035 ; F24T10/15 ; H01B1/02 ; H05K1/02 ; H05K9/00

Abstract:
Electromagnetic interference (EMI) shields and methods for broadband EMI shielding are provided. An EMI shield disposed in a path of electromagnetic radiation blocks a broad range of frequencies (>about 800 MHz to to 20 dB, while transmitting wavelengths in a visible range to an average transmission efficiency of >about 85% through the electromagnetic shield. The shield includes a flexible stack comprising a continuous ultrathin metal film comprising silver (Ag) and copper (Cu) and two antireflection dielectric layers disposed on either side of the ultrathin metal film. The shield may also include multiple stacks or an optional graphene layer that may be spaced apart from the flexible stack to achieve radiofrequency (RE) absorption, which provides additional form of EMI shielding. The EMI shield can be made via roll-to-roll sputtering.
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