Invention Grant
- Patent Title: Photosensitive component, and camera module and manufacturing method therefor
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Application No.: US16322946Application Date: 2017-06-02
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Publication No.: US11388320B2Publication Date: 2022-07-12
- Inventor: Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: CN201610516600.2 20160703,CN201620691699.5 20160703,CN201611067131.7 20161128,CN201621286847.1 20161128,CN201710065909.9 20170206,CN201720112605.9 20170206
- International Application: PCT/CN2017/086998 WO 20170602
- International Announcement: WO2018/006673 WO 20180111
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H05K1/02
Abstract:
A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
Public/Granted literature
- US20210306530A1 Photosensitive Component, And Camera Module And Manufacturing Method Therefor Public/Granted day:2021-09-30
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