Invention Grant
- Patent Title: Solid-state imaging apparatus and electronic apparatus
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Application No.: US17267385Application Date: 2019-07-25
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Publication No.: US11405571B2Publication Date: 2022-08-02
- Inventor: Yusuke Ikeda
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2018-153508 20180817,JPJP2018-210836 20181108
- International Application: PCT/JP2019/029323 WO 20190725
- International Announcement: WO2020/036051 WO 20200220
- Main IPC: H04N5/3745
- IPC: H04N5/3745 ; H04N5/369 ; H04N5/374 ; H04N9/04

Abstract:
Changing the analog gain for each of columns while suppressing an expansion of area and an increase in power consumption. A solid-state imaging apparatus (1, 1A) according to an embodiment includes: converters (10A to 10D) connected to a vertical signal line (VSL) extending from a pixel array unit (30); a voltage generator (20) that is connected to a plurality of voltage lines and outputs reference voltages having mutually different voltage values individually to the plurality of voltage lines; wiring lines (L10 to L31, L20 to L23) connecting the converter and the plurality of voltage lines; and switches (SW0 to SW3) provided on the wiring line and configured to perform changeover of the voltage lines connected to the converter to one of the plurality of voltage lines.
Public/Granted literature
- US20210297623A1 SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS Public/Granted day:2021-09-23
Information query
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