The present invention relates to a multi-layer susceptor assembly for inductively heating an aerosol-forming substrate which comprises at least a first layer and a second layer intimately coupled to the first layer. The first layer comprises a first susceptor material. The second layer comprises a second susceptor material having a Curie temperature lower than 500° C. The susceptor assembly further comprises a third layer intimately coupled to the second layer which comprises a specific stress-compensating material and a specific layer thickness such that after a processing of the multi-layer susceptor assembly the third layer exerts a tensile or compressive stress onto the second layer at least in a compensation temperature range for counteracting a compressive or tensile stress exerted by the first layer onto the second layer. The compensation temperature range extends at least from 20 K below the Curie temperature of the second susceptor material up to the Curie temperature of the second susceptor material.