Invention Grant
- Patent Title: Modular liquid cooling assembly
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Application No.: US16831411Application Date: 2020-03-26
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Publication No.: US11406041B1Publication Date: 2022-08-02
- Inventor: Steve Qingjun Cai , Unnikrishnan Vadakkanmaruveedu
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; F28D15/00

Abstract:
An electronic system includes a chassis, a liquid coolant supply line assembly, a first electronic subassembly, a second electronic subassembly, and a liquid coolant return line assembly. The liquid coolant supply line assembly includes a coolant supply line configured to receive and convey liquid coolant. The first electronic subassembly includes a first electronic component and a first cooling loop to transfer heat from the first electronic component into the liquid coolant. The second electronic subassembly includes a second electronic component and a second cooling loop to transfer heat from the second electronic component into the liquid coolant The liquid coolant return line assembly includes a coolant return line to receive liquid coolant from the first and second cooling loops.
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