Invention Grant
- Patent Title: Preheat three-dimensional (3D) printer build material
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Application No.: US16075219Application Date: 2017-04-20
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Publication No.: US11407175B2Publication Date: 2022-08-09
- Inventor: Kenneth Williams , Brent Ewald
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2017/028635 WO 20170420
- International Announcement: WO2018/194623 WO 20181025
- Main IPC: B29C64/314
- IPC: B29C64/314 ; B33Y30/00 ; B29C64/295 ; B33Y40/10 ; H05B3/00 ; H05B3/22 ; B29C64/205 ; B33Y10/00 ; B29C64/153

Abstract:
In some examples, preheat three-dimensional (3D) printer build material can include a heating plate of a 3D printer to preheat build material from below the build material, where the heating plate is located adjacent to a build platform of the 3D printer, and a heater-spreader carriage of the 3D printer to preheat the build material from above the build material and spread the preheated build material from the heating plate to the build platform.
Public/Granted literature
- US20210197468A1 PREHEAT THREE-DIMENSIONAL (3D) PRINTER BUILD MATERIAL Public/Granted day:2021-07-01
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