This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.