Invention Grant
- Patent Title: Packaging material and packaging structure made by using same
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Application No.: US14424556Application Date: 2013-09-24
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Publication No.: US11407212B2Publication Date: 2022-08-09
- Inventor: Yoichi Ishizaki , Yoshihiro Ohta
- Applicant: Toyo Seikan Group Holdings, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Toyo Seikan Group Holdings, Ltd.
- Current Assignee: Toyo Seikan Group Holdings, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: JPJP2012-208812 20120921
- International Application: PCT/JP2013/075655 WO 20130924
- International Announcement: WO2014/046277 WO 20140327
- Main IPC: B32B27/36
- IPC: B32B27/36 ; B32B15/20 ; B32B27/08 ; B32B15/09 ; A61F13/00 ; A61K9/70 ; B32B7/12 ; B65D85/00 ; A61K8/02

Abstract:
The present invention provides a packaging material for a patch, the packaging material comprising: an inner layer film made of a polyethylene terephthalate-based resin having heat sealing properties; and a substrate film, wherein a heat-sealing surface of the inner layer film comprises an isophthalic acid-modified polyethylene terephthalate resin having a copolymerization ratio of isophthalic acid component of 10 mol % to 20 mol %. More preferably, the inner layer film made of the polyethylene terephthalate-based resin having heat sealing properties is a multi-layer film comprising at least two layers including a heat sealing surface side layer made of an isophthalic acid-modified polyethylene terephthalate resin having a copolymerization ratio of isophthalic acid component of 10 mol % to 20 mol % and a layer made of an isophthalic acid-modified polyethylene terephthalate resin having a copolymerization ratio of isophthalic acid component of 0 mol % to 5 mol %.
Public/Granted literature
- US20150258757A1 PACKAGING MATERIAL AND PACKAGING STRUCTURE MADE BY USING SAME Public/Granted day:2015-09-17
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