In a liquid ejecting head, an electrical connection portion between an element substrate and a wiring substrate can be satisfactorily sealed, and a decrease in yield and an increase in manufacturing cost can be suppressed. The liquid ejecting head includes the element substrate having a plurality of energy generating elements and a plurality of electrodes, and the wiring substrate having a plurality of electrode terminals connected to the plurality of electrodes. The element substrate and the wiring substrate are overlapped with each other in a state where the electrode and the electrode terminal face each other, a connection portion is surrounded by a resin layer, and the resin layer is covered with a sealing resin. The resin layer is divided into a plurality of portions by a gap provided in a portion between both end portions of the electrode terminal in an arrangement direction. An inside of the gap is filled with the sealing resin.