Invention Grant
- Patent Title: Heat management device
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Application No.: US17182887Application Date: 2021-02-23
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Publication No.: US11407281B2Publication Date: 2022-08-09
- Inventor: Kohji Kinoshita , Shoma Hanano , Yoshio Hasegawa , Manabu Orihashi , Hideyuki Kawai , Kenichi Kubota , Makoto Ikegami , Yuuki Kimura
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA , SUBARU CORPORATION
- Applicant Address: JP Toyota; JP Tokyo
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,SUBARU CORPORATION
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,SUBARU CORPORATION
- Current Assignee Address: JP Toyota; JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2020-046883 20200317
- Main IPC: B60H1/08
- IPC: B60H1/08 ; F01P3/20 ; B60K11/04

Abstract:
A heat management device may include: a first heat circuit; a second heat circuit; a heat exchanger configured to cool the first heat circuit and heat the second heat circuit; air-heating apparatus configured to heat air using the second heat circuit; a battery and electrical apparatus configured to be cooled by the first heat circuit; and a radiator configured to exchange heat between the first heat circuit and outside air. A controller may be configured, in the second process, to cause the heat exchanger to cool the heat exchanger passage while a heat medium circulates in the heat exchanger passage and the battery passage and bypasses the radiator passage. The controller may be configured, in the third process, to cause the radiator to cool the heat medium while the heat medium circulates in the radiator passage and the electrical apparatus passage and bypasses the heat exchanger passage.
Public/Granted literature
- US20210291625A1 HEAT MANAGEMENT DEVICE Public/Granted day:2021-09-23
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