Invention Grant
- Patent Title: Packaging structure with resilient positioning flaps
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Application No.: US17227319Application Date: 2021-04-11
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Publication No.: US11407553B2Publication Date: 2022-08-09
- Inventor: Pin-Ying Wu , Hsin-Yi Chang , Tung-Yen Yang
- Applicant: Alpha Networks Inc.
- Applicant Address: TW Hsinchu
- Assignee: Alpha Networks Inc.
- Current Assignee: Alpha Networks Inc.
- Current Assignee Address: TW Hsinchu
- Agency: CIPO IP Group
- Priority: TW109140880 20201120
- Main IPC: B65D5/50
- IPC: B65D5/50

Abstract:
A packaging structure having resilient positioning flaps can have a particular shape formed by folding a planar sheet including a left fixing portion, a right fixing portion, and a main body portion whose left and right edges are each respectively connected to a connecting portion. The connecting portions are connected to the left and right fixing portions, respectively. Two spaced-apart pressed lines are formed on each fixing portion so that the fixing portions can be bent toward the main body portion along the press lines. Each fixing portion is formed with an opening having a portion of its periphery formed with cuttings extending away from the opening to form resilient positioning flaps. When the package structure is folded and a product is extended therein from the openings, the resilient positioning flaps can be engaged in a concave space of the product to position the product in the packaging structure.
Public/Granted literature
- US20220161961A1 PACKAGING STRUCTURE WITH RESILIENT POSITIONING FLAPS Public/Granted day:2022-05-26
Information query
IPC分类: