Invention Grant
- Patent Title: Pack through eject panel
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Application No.: US16966484Application Date: 2018-02-09
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Publication No.: US11407586B2Publication Date: 2022-08-09
- Inventor: Claude Boivin , Eric Boivin , Hugo Marsan
- Applicant: The Heil Co.
- Applicant Address: US TN Chattanooga
- Assignee: The Heil Co.
- Current Assignee: The Heil Co.
- Current Assignee Address: US TN Chattanooga
- Agency: Fish & Richardson P.C.
- International Application: PCT/CA2018/050149 WO 20180209
- International Announcement: WO2019/153066 WO 20190815
- Main IPC: B65F3/22
- IPC: B65F3/22 ; B65F3/24 ; B65F3/00

Abstract:
There is disclosed a waste collecting device having a container for receiving waste therein. The container has an end wall and an ejector panel. The container encloses a waste receiving volume. The ejector panel has an opening therethrough for allowing access to the waste receiving volume for receiving the waste. The waste collecting device further has a compactor outside the waste receiving volume being operable for pushing the waste in the container through the opening. The ejector panel is movable within the waste receiving volume and relative to a floor of the container for pushing the waste out of the waste receiving volume. A method of operating a waste collecting device is also disclosed.
Public/Granted literature
- US20210039880A1 PACK THROUGH EJECT PANEL Public/Granted day:2021-02-11
Information query
IPC分类: