Invention Grant
- Patent Title: Heat-processing device and heat-processing method
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Application No.: US16078804Application Date: 2017-03-01
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Publication No.: US11408043B2Publication Date: 2022-08-09
- Inventor: Yasutoshi Ito , Shintaro Suzuki , Yoshiya Mano
- Applicant: NTN CORPORATION
- Applicant Address: JP Osaka
- Assignee: NTN CORPORATION
- Current Assignee: NTN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2016-040120 20160302,JPJP2016-069032 20160330
- International Application: PCT/JP2017/008169 WO 20170301
- International Announcement: WO2017/150627 WO 20170908
- Main IPC: C21D9/40
- IPC: C21D9/40 ; H05B6/44 ; C21D1/42 ; H05B6/36 ; H05B6/10 ; C21D1/10 ; F16C33/64 ; H05B6/06 ; H05B6/40

Abstract:
Provided is a heat treatment apparatus (1), including: a heating unit (2), which is configured to inductively heat a workpiece (W) to a target temperature; and a drive mechanism, which is configured to move a plurality of the coaxially held workpieces (W) relative to the heating unit (2) being in an energized state in an axial direction of the workpiece (W), wherein the heating unit (2) includes: a plurality of coil members (11) respectively including a ring-shaped coil portion (11a) arranged coaxially with the workpiece (W) so as to be capable of surrounding the workpiece (W); and a frame body (21), which is configured to support each of the plurality of coil members (11) so as to be movable in the axial direction of the workpiece while maintaining the coaxial arrangement between the coil portions (11a).
Public/Granted literature
- US20190055618A1 HEAT-PROCESSING DEVICE AND HEAT-PROCESSING METHOD Public/Granted day:2019-02-21
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